System Level Thermal Design - Process Modeling for Functional/Structure Design using SysML and MDM

DSM 2015: Modeling and managing complex systems - Proceedings of the 17th International DSM Conference Fort Worth (Texas, USA), 4-6 November 2015

Year: 2015
Editor: Browning, T. R.; Eppinger, S. D.; Schmidt, D. M.; Lindemann, U.
Author: Seki, K.; Muraoka, Y.; Nishimura, H.
Series: DSM
Section: Modelin Functions and Functionality of Complex Systems
Page(s): 149-159


The conventional thermal design process for consumer electronics focusing exclusively on hardware is becoming insufficient for limiting thermal risk in the market. This study uses system modeling language (SysML) and a multiple- domain matrix (MDM) to examine the thermal design process at the system level, which comprises both hardware and software. The entire thermal design process is visualized using an MDM comprising design structure matrices for the function, performance, and structure of a product and the correlations between them. It is demonstrated through the trade-off study of image processor selection and a machine design that our proposed thermal design process can lead better product specifications in terms of thermal performance and parts cost.

Keywords: Thermal design, Consumer product, Software design, Design Structure Matrix, Domain Mapping Matrix, Multiple-Domain Matrix

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