ECO-DESIGN FOR MICROELECTRONIC PRODUCTS: MEASUREMENT AND INTEGRATION OF ENVIRONMENTAL CRITERIA FOR PACKAGE DESIGN

DS 70: Proceedings of DESIGN 2012, the 12th International Design Conference, Dubrovnik, Croatia

Year: 2012
Editor: Marjanovic Dorian, Storga Mario, Pavkovic Neven, Bojcetic Nenad
Author: Villard, A.; Petit, L.; Lelah, A.; Brissaud, D.
Section: Design methods
Page(s): 1177-1184

Abstract

This paper presents an eco-design tool, dedicated to designers of packages for microelectronic components. The tool aims to increase designers’ environmental consciousness and to drive them to explore innovative opportunities. It has been developed in clo

Keywords: eco-design, microelectronic product, life cycle assessment, chips packaging

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