A PARAMETRIC DESIGN FRAMEWORK TO SUPPORT STRUCTURAL AND FUNCTIONAL MODELING OF COMPLEX CONSUMER ELECTRONICS PRODUCTS

DS 68-6: Proceedings of the 18th International Conference on Engineering Design (ICED 11), Impacting Society through Engineering Design, Vol. 6: Design Information and Knowledge, Lyngby/Copenhagen, Denmark, 15.-19.08.2011

Year: 2011
Editor: Culley, S.J.; Hicks, B.J.; McAloone, T.C.; Howard, T.J. & Chen, W.
Author: Seki, Kenichi; Nishimura, Hidekazu; Zhu, Shaopeng; Balmelli, Laurent
Series: ICED
Section: Design Information and Knowledge Management
Page(s): 282-291

Abstract

Today's market demand for smaller and more powerful consumer electronic devices poses a major challenge to the rapid design of products. In addition, the ability to perform strategic coordination among different stakeholders within the enterprise increasingly becomes an important criterion for global engineering. In this study, we first introduce a typical design process involving distributed design teams. In particular, this process allows a thermal–acoustic design of cavities, i.e., air space inside the enclosure, in terms of flow rate and acoustic radiation resistance. Then, we investigate a module-based design optimization approach defining cavity as a module to efficiently support such processes. We ensure the design control of both cavity characteristics in an internationally distributed project through design data analysis using the Systems Modeling Language (SysML) and the resulting product model descriptions of the system architecture.

Keywords: THERMAL DESIGN; SYSML; PRODUCT DEVELOPMENT PROCESS; CONSUMER ELECTRONICS; COLLABORATIVE DESIGN

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